Abstract

Electrolytic tough pitch copper is commonly used in electric and electronic applications while fine copper wires are widely used in electronic conductors. A multi-pass wiredrawing process was designed for the manufacturing of fine pure copper wire, from 0.50 mm to 0.10 mm in diameter. The analytical model and the finite element analysis (FEA) were performed to validate the pass schedule design. The initial wire was mechanically characterized, and the pass schedule design was stablished by the analytical method according to the specific criteria. The sequence of wiredrawing passes was modeled in the finite element method (FEM) software in order to analyze and validate the designed pass schedule. The combination of these methods allowed designing and validating the wiredrawing pass schedule to implement it in a real process with guaranteed results. This work contributes in showing a combined methodology for the design and virtual validation of the pass schedule in the case of multistage wiredrawing of ETP copper fine wires.

Highlights

  • Fine wire is manufactured with metals such as stainless steel, gold, magnesium, tungsten, rhodium and copper by a sequential multi-pass wiredrawing process [1,2,3,4,5,6]

  • Rubio produced by the sequential multi-pass wiredrawing, involves demonstrated feasibility of the combination ofthe theso-called slab method line andprocess”, numericalwhich simulation for etmoderate al. demonstrated the feasibility of the combination of the slab method and numerical simulation advancing speed combined with continuous annealing

  • Since our objective was to study the possibilities of processing this material in a subsequent fine wiredrawing process, a tensile test was performed to obtain the mechanical properties of specimens

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Summary

Introduction

Fine wire is manufactured with metals such as stainless steel, gold, magnesium, tungsten, rhodium and copper by a sequential multi-pass wiredrawing process [1,2,3,4,5,6]. Fine round section copper products are manufactured by wiredrawing with polycrystalline or natural single crystal diamond dies [7]. The area reduction of pure copper is limited to about 90% just before a first annealing. Fine copper wire is often produced by sequential multi-pass wiredrawing, the so-called “in line process”, which involves moderate advancing speed combined with continuous annealing

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