Field-use conditions vs. thermal cycles - a physics-based mapping study

Abstract

A physics-based approach that maps the solder damage induced through accumulated inelastic strain or accumulated strain energy density under field-use conditions with thermal cycling conditions has been developed. Various representative packages - Super Ball Grid Array (SBGA), Flip Chip Chip Scale Package (FCCSP), and Flip Chip On Board (FCOB) have been analyzed using the mapping methodology for automotive, military avionics and implantable medical device applications. In-house experimental data has been used to validate the modeling methodology and the approach presented. As the plastic and the creep deformation are fundamentally different, alternative accelerated thermal cycling profiles have been developed to mimic the solder damage and degradation during field-use thermal conditions.