Abstract
ABSTRACT The purpose of this study is to analyse the heat flux difference and examine applicability of the heat flux sensor along with various sensor attachment methods. Using multiple sensors and various tapes, a KS F 2278 thermal test was performed in hot/cold chamber conditions with standard panel specimen. The measured heat flux values of sensors were stable. But values of sensors were smaller than the heat flux result of KS F 2278. Thus, thermal resistance of attachment tape on a sensor should be considered during on site U-value measuring process. This study also examined the differences between measured U-value and design U-value by attaching the different sensors in the same area using multiple heat flux sensors. All cases are shown to the same patterns on each heat flux and U-value graph, but U-values with regard to various sensors have shown some differences to the designed values. Using in-situ measurement, the EIFS wall was found to be difficult to measure accurately due to the small level of heat flux.
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