Field emission diodes using sharp vertical edge structure

Abstract

Field emission diodes with sharp vertical edges have been fabricated for possible future cathodoluminescence and high frequency device applications. These devices are formed using self-aligned planar processing methods based on conformal thin film deposition techniques thereby eliminating many of the fabrication difficulty and performance variation associated with other previously used fabrication methods. Recessed sealed vacuum cavities have been formed as part thereby eliminating the need for external vacuum pumping.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>