Abstract
To investigate the interface delamination in three-dimensional components in the nano-size, an experimental method is developed for the crack initiation at interface edge in nano-materials by using the focused ion beam (FIB) and the transmission electron microscopy (TEM). With FIB, a nano-cantilever specimen consisting of 200-nm-thick copper (Cu) layer and 1000-nm-thick silicon nitride (SiN) layer on a silicon (Si) substrate is fabricated from a macroscale multi-layered material (Si/Cu/SiN) with the proposed method. By using a minute loading apparatus, the loading experiment is conducted in TEM, and the crack initiation at the edge of Cu/Si interface in different specimens is in situ observed. The detailed stress fields at crack initiation are analyzed with the finite element method, and both normal and shear stresses concentrate at the region of 100 nm from the interface edge in all specimens. In addition, the normal stress is much larger than the shear one. A close observation on stress fields shows that the normal stress field at the area 5 nm away from interface edge produces the local criterion for crack initiation at the edge of Cu/Si interface in nanoscale components.
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