Few-Layers Graphene Film and Copper Surface Morphology for Improved Corrosion Protection of Copper

Abstract

Graphene has shown excellent corrosion protection of copper (Cu). The corrosion protection of Cu is governed by the characteristics of the deposited graphene and Cu surface morphology underneath. In this work, graphene films (1-2, 4-5 layers) were deposited on Cu using a chemical vapor deposition by changing hydrogen (H2) concentration during the annealing stage. The chemical structure and surface microstructural features of graphene/Cu were inspected by Raman spectroscopy, scanning electron microscopy, transmission electron microscopy, and atomic force microscopy. The electrochemical corrosion performance of graphene/Cu was studied in 0.5 M sodium chloride solution using potentiodynamic polarization and electrochemical impedance spectroscopic measurements. The 1-2 layers of graphene and rough Cu surface were obtained for low H2 concentrations (0 and 2.5%), whereas high H2 concentrations, 20 and 50%, resulted in a smooth Cu surface and 4-5 layers of graphene. Our results showed that Cu with a smooth surface and multilayer graphene film exhibited the best corrosion resistance against electrochemical degradation. Tafel analysis revealed that Cu with 4-5 layers of graphene coating corroded nearly three orders of magnitude slower than the annealed Cu, without graphene coating. The results of this study can be useful for several applications where Cu is in close contact with salt species.