Femtosecond pulsed laser fabrication of a novel SCD grinding tool with positive rake angle

Abstract

Ablating a single-crystal diamond (SCD) plate with a femtosecond laser to fabricate a novel abrasive regularly arranged binder-less face grinding tool with acute inclination angle at the edge of the micro grains was proposed in this paper. A Ti:Sapphire femtosecond laser with a wavelength of 1030 nm and a pulse width of 250 fs was used for the ablation experiments. The effects of processing parameters, especially the ablation track pitch on the ablation surface quality of the diamond, were investigated in advance. Based on the optimal processing parameters, an array of square frustum microabrasive with grain inclination angle of approximately 100° was fabricated on the surface of SCD according to the predesigned laser scanning path. The microabrasive array was subsequently ablated to reduce the inclination angle at the edge of the micrograins to approximately 80°, and a novel abrasive regularly arranged binder-less diamond face grinding tool with positive rake angle which was expected to decrease the grinding force and improve the surface quality of hard and brittle materials had been fabricated for the first time.