Femtosecond interferometry for analysis of internal bond interface delamination in semiconductor devices

Abstract

Summary form only given. We developed an ultrafast Twyman-Green interferometer to monitor deformations in the bonding layer between two materials. Using femtosecond pulses with photon energies in the transparent regime of the top semiconductor layer, we can image, in real time, any debonding at internal interfaces. These composite multilayered semiconductor structures are widely used in electronic packaging.