Abstract
1. In indium films of the test thicknesses, an anomaly is observed in the temperature dependence for ultimate strength; values are close to those for solid metal whereas yield point and CSS are much higher. 2. The presence of grain boundaries affects both indium film strength properties and stress relaxation parameters. 3. Maximum strain and the amount of stress drop in films are more significant than in solid metal. 4. Depending on deformation and temperature, internal stresses in test films may be 0.4–0.9 of the applied loads. 5. The mechanism controlling indium film plastic strain may be crossover of moving dislocations with forest dislocations.
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