Abstract
This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.
Highlights
The challenge for a higher functional diversification in future systems (More-than-Moore) is expected to become more important than the continued scaling of the transistor density (More Moore) [1]
Scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 μm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications
Electrical contacting could be done with physical vapor deposition (PVD), chemical vapor deposition (CVD), or digital printing technologies using inks with metallic nanoparticles
Summary
The challenge for a higher functional diversification in future systems (More-than-Moore) is expected to become more important than the continued scaling of the transistor density (More Moore) [1] This can be encountered by heterogeneous integration of components with specific tasks, e.g., power control, radio frequency (RF) communication, passive components, sensors, and actuators, into a system-in-package (SiP). This is already an established strategy for rigid system carriers, but still in development for system-in-foil (SiF) applications that feature minimum thicknesses, low weight, and mechanical flexibility. The handling of ultrathin chips is more challenging than the handling of stiff, standard components bbeeccaauussee ooff tthhee wwaarrppaaggee ooff tthhee tthhiinnnneedd cchhiippss [[1166––1188]]. R[2e3a–s2o7n]s. mccmamRueBraoehbnuleeiaastmaotstsareycioiisuasrapndhmioettrnboiehnccnpgaaesniahsentrnenketostnmhhdacn.acatoeveeouTsamcsawaythocosmioshnliplmscmasbeiaoehabsdewlpmnadsallgeeilteihotneebennhnerxdgalgekatscybssiibafkvndoycnaoomenhgusecunsatomaetaethawl-accmlmauonaodehlnnpndnmehiucnsddgeoltaaptethilsgrnusiinlsiaepenesvs.tgitexlogireeesamTmssschtbocihyuabatnaoofshirnnltugmstiyeuednedtdolpmglwfotitfemor.nfhfaoamcnOageutsrtoecwihikulnnrbnetoillios-nitfyctpuldiiuiasploiuptecetsfryrlimhlisetntnehaicomrgopugmosaofnss.tolmosathbeseOrfruomtlpieamyarnnrtota,osbuhluntdptycmllehiyelhteinstrffiienaciifarpptocttesttcetofslhhhuedacmieiostasolnuwtfssnpraialeefetcloocbemrsdshaenaaeoi-siobsitefpcunphnfirnlobisypeioctnnipm,csuluasttirclrtbsctssoethooyiiseicrcenlemeeeilanasrgsemonepsetdufiisabofinblepfiultnasocemyrlteupraaorcanobtrctetmoolhhetiflssnsenmcieeomandigtabtsera.reueennotccodBellotahhftlpidesieriapalupssesdaseivcllsfpsdcetmiaafeireroenucicamonblsrehgsatctl-hitbibtieeunhpfhiosldlinpgyeesescf. wasistehmthbilcyknoefsmseuslotifp3l0e μchmipassswemithbltehdicoknngeslassess aonfd3f0oiμl msubasstsreamtebsl.eWd eoinnvgelastsisgaatnedd feoaiclhssuibnsgtlreatperso.cWeses sintevpe,sbtieggaitnendinegacfhrosmingdleetapcrhoicnegssuslttreapt,hbinegcihninpisnfgrofmromthedremtaaclhrienlegauseltrfoatilhtion tchheipcsonfrsotrmuctthioenrmoaf lsrueilteaabslee dmffoienaitlacalhtcothirnitanehngefsoafcernorhdntisohgtahranunpdclatlaiiuonctengommtooefoanstltseudafiotcaacrbsuuslreleatmrcdayebt.htlayincmhcioanmcghpainonendefnohtrasnhudinglihtnilpgthltaeocofielmnsaeflontrrtaaunclsctfruearrtahtcoiyna.ncoamutpoomnaetnetds ausnsetiml tbhlye
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