Abstract
In the field of power electronics, assembly and interconnection technologies play an important role for the design of modules and systems. The applied packaging technologies largely determine the electrical, thermal and mechanical properties of the final module. In addition to conventional solder technology upcoming technologies like sintering, transient liquid phase soldering, adhesive bonding or even reactive multilayer materials are interesting methods for the realization of the die attach. [1] This paper is about a combination of sintering and adhesive bonding for the interconnection of power electronics components. As interconnection material a highly viscous conductive silver ink is used. Additionally also sensor structures were printed with the same silver ink to test the potentials for condition monitoring applications in the field of power electronics.
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