Abstract
The main external factor of solder joints degradation or deviation from an expected normal condition is the time stress such as work and environment stresses.A damage assessment method for solder joints based on time stress monitoring and three-dimensional finite element model is introduced.A damage-fault evolution model of solder joints based on hidden Markov mod- els (HMM) is put forward.And then,the fault prognosis technology of the solder joints is researched based on the HMM model, real-time damage information and life consumption prognosis method.The detailed process and algorithm of the fault prognosis technology are studied based on time stress monitoring.Finally,the validity of the technology is proved by an experimental study of plastic quad flat package (PQFP) solder joints.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
