Abstract
Solder bump inspection of flip chip has gained more attention with the widely use of flip chip package technologies in microelectronics packaging industry. A non-destructive testing method using ultrasonic excitation and modal analysis was presented for the detection of solder bump missing, a typical defect occurred in flip chip. The flip chip with arrayed solder bumps is modelled, and the effect of solder bump missing on the modal frequencies is investigated. The shifting of the natural frequencies of the reference flip chips and defect flip chips are simulated and measured in the experiments. The analysis results of the theoretical calculation, simulation and experiments all reveal that the natural frequencies of defective chips are smaller than the ones of non-defective chips, which can be used for defective flip chips detection. Therefore, the modal analysis can be a useful tool for fault diagnosis of flip chip.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.