Fatty acid based novel precursors for polyesteramide hot melt adhesive

Abstract

Polyesteramide (PEA) based hot melt adhesive (HMA) was successfully designed containing a high content of renewable mass. The PEA HMA was synthesized based on dimer acid (DA), catechol, ethylenediamine (EDA), ricinoleic acid amide (RA amide) which was synthesized by using ricinoleic acid and diethanolamine. RA amide was reacted with dimer acid with a varying concentration of RA amide by 5%, 10%, 15% and 20% on a molar basis. Catechol was further added on the molar basis of 10%, 20%, and 30% as a partial replacement of ethylenediamine. The effect on the properties of the hot melt adhesive, such as mechanical properties: tensile strength, shore D hardness, elongation at break; thermal properties: glass transition temperature (Tg), melting temperature (Tm), heat of crystallization (Hc), crystallization temperature (Tc); adhesion properties: lap shear strength (LSS) and T-peel strength (TPS); rheological properties and degree of crystallinity was investigated. It was observed that the mechanical and thermal properties are increased with increasing concentration of RA amide and catechol. These HMA materials could hold potential for sustainability and high adhesive performance.