Abstract

Chapter 4 deals with low cycle fatigue tests and derivation of fatigue life prediction models curve-fitted to the fatigue test data for Sn–Ag–Cu and Sn–Cu solder alloys. The fatigue tests were conducted under low cycle fatigue test conditions over a wide range of isothermal temperatures (−40°C to +125°C) and frequencies. Both the strain-range and energy-based low cycle fatigue models were used. The fatigue life prediction model constants are presented in tables and closed-form equations for easy use to predict the solder joint fatigue life when the inelastic strain range or inelastic strain energy density fatigue driving force parameter is obtained from an FEA result.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.