Abstract
The objective of this work is to model the fatigue damage process in a solder bump subjected to cyclic loading conditions. Fatigue damage is simulated using the cohesive zone methodology. Damage is assumed to occur at interfaces modeled through cohesive zones in the material, while the bulk material is assumed to be linear elastic. The state of damage at a cohesive zone is incorporated into the cohesive zone constitutive law by a elasticity-based damage variable. The gradual degradation of the solder material and the corresponding damage accumulation throughout the cycling process is accounted for by a damage evolution law which captures the main damage characteristics. The model prediction of the solder bump life-time is shown to be in good agreement with one of the commonly used empirical life-time prediction laws.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
