Abstract
A pure copper used as an electronic material was reinforced by using low-carbon steels as a clad plate with relatively small thickness of t = 1, 2, 3 mm, so as to improve the fatigue properties of the advanced electronic parts. Using stress intensity factor range ΔK and Young's modulus E, the fatigue crack propagation rate, da/dN, for the clad plates was expressed by a power low of ΔK/E as well as for the copper and low-carbon steel base materials. There was large scatter in the da/dN values for the thicker clad plate. On the other hand, there was very small scatter in the da/dN-ΔKest/E relation for all clad plates, where ΔKest/E was evaluated from the measured crack opening displacement. Under the same ΔKest/E value, the da/dN for the thicker clad plate with the concave-convex and zigzag crack front in the inner copper was lower than that for the thinner clad plate which has almost the same da/dN-ΔKest/E relation as the base low-carbon steel.
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