Abstract
In order to clarify the simple shear strength of solder joint, we carried out static strength tests, fatigue tests, fatigue crack growth tests and creep crack growth tests on Cu/60Sn·40Pb/Cu joint under simple shear stress. Major conclusions obtained in this study are summarized as follows : 1) The maximum simple shear stress increased with the increase in the simple shear strain rate. 2) The effect of the width of the solder on the fatigue strength were not observed. 3) The fatigue cyclic crack growth rates were governed by neither the stress intensity factor range nor the maximum stress intensity factor. 4) The fatigue and creep loading time crack growth rates were governed by the modified J integral. 5) The fatigue and creep crack growth behaviors depended on the process zone (small scale creep zone) at the crack tip.
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