Abstract
In this study, to investigate the mean stress effect on fatigue life of a 12 μm thick copper thin film, fatigue tests were performed at four maximum stress levels for a wide range of stress ratios. Tensile and creep tests were also performed to obtain the reference mechanical properties of the copper thin film tested. The fatigue behavior of copper thin films depended on the regions of the stress ratio and the modified Goodman and Gerber equations could not describe the mean stress effect on fatigue life well. The Haigh diagram was constructed using stress vs. life curve data obtained in this study, and the constant life curve was approximated by three straight lines. The Haigh diagram for copper thin films can be classified into three regimes: fatigue, fatigue-creep, and creep, depending on the fracture mode. The fatigue life can be well described with the equivalent stress amplitude calculated from the constant life curve, regardless of stress ratio.
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