Fatigue and failure behaviors of silver-filled electronically-conductive adhesive joints subjected to elevated humidity

Abstract

Conductive adhesives are used in electronics packaging applications for hybrid, die-attach and display assemblies. There are a number of issues of concern in the design of joints bonded using electronically-conductive adhesives (ECAs). An important issue is the cyclic fatigue behavior of conductive adhesive joints under elevated humidity environments, in which failures may occur due to cyclic mechanical and/or thermal stresses. This paper addresses the effect of elevated humidity levels on the fatigue and failure behaviors of ECAs. For this purpose, joints were prepared using stainless-steel adherend specimens and a commercial ECA, and tested under monotonic and cyclic fatigue conditions, at two humidity levels, namely 20% and 90% relative humidity at 28°C. Furthermore, joint failure mechanisms were analyzed using optical techniques, and joint conductivity measurements. Load versus number of cycles (P–N) curves were generated using these specimens at three different load ratios (R), namely 0.1, 0.5 and 0.9, at a cyclic frequency of 150 Hz. The P–N curves were parallel and the failure modes were found to be predominantly interfacial, accompanied by a significant decrease in joint conductivity.