Fatigue analysis and testing of adhesive joints : Krenk, S., Jonsson, J., and Hansen, L.P. Eng. Fract. Mech. (1996) 53 (6), 859–872

Abstract

Tin–lead solder alloys are widely used in the electronic industry. They serve as interconnects that provide the conductive path required to achieve connection from one circuit element to another. There are increasing concerns with the use of tin–lead alloy solders in recognition of hazards of using lead. Lead-free solders and electrically conductive adhesives (ECAs) have been considered as the most promising alternatives of tin-lead solder. ECAs consist of a polymeric resin (such as, an epoxy, a silicone, or a polyimide) that provides physical and mechanical properties such as adhesion, mechanical strength, impact strength, and a metal filler (such as, silver, gold, nickel or copper) that conducts electricity. ECAs offer numerous advantages over conventional solder technology, such as environmental friendliness, mild processing conditions (enabling the use of heat-sensitive and low-cost components and substrates), fewer processing steps (reducing processing cost), low stress on the substrates, and fine pitch interconnect capability (enabling the miniaturization of electronic devices). Therefore, conductive adhesives have been used in liquid crystal display (LCD) and smart card applications as an interconnect material and in flip–chip assembly, chip scale package (CSP) and ball grid array (BGA) applications in replacement of solder. However, no currently commercialized ECAs can replace tin–lead metal solders in all applications due to some challenging issues such as lower electrical conductivity, conductivity fatigue (decreased conductivity at elevated temperature and humidity aging or normal use condition) in reliability testing, limited current-carrying capability, and poor impact strength. Considerable research has been conducted recently to study and optimize the performance of ECAs, such as electrical, mechanical and thermal behaviors improvement as well as reliability enhancement under various conditions. This review article will discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry.