Abstract
The rapid inward migration of fluoride ions in growing anodic titanium oxide under a high electric field has been elucidated by anodizing a Ti–12 at% silicon alloy, where film growth proceeds at nearly 100% efficiency in selected electrolytes. Further, incorporated silicon species in the anodic film are immobile, acting as marker species. The migration rate of fluoride ions is determined precisely by three-stage anodizing, consisting of initial anodic film formation at a constant current density to 50 V in ammonium pentaborate electrolyte, subsequent incorporation of fluoride ions by reanodizing to 55 V in ammonium fluoride electrolyte and, finally, anodizing again in ammonium pentaborate electrolyte at high current efficiency. The resultant films were analyzed by glow discharge optical emission spectroscopy to reveal the depth distribution of fluoride ions and the location of the silicon marker species. The fluoride ions migrate inward at twice the rate of O 2− ions. Consequently, anodizing of titanium in fluoride-containing electrolytes develops a fluoride-rich layer that separates the alloy substrate from the anodic oxide, with eventual detachment of the film from the substrate.
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