Fast heating and cooling in nanoimprint using a spring-loaded adapter in a preheated press

Abstract

By using a spring-loaded adapter, instant heating and cooling of wafer-type substrates was implemented in standard hot embossing equipment. This was possible by using the well-known concept of a clamped stack of stamp and substrate, pre-assembled in an alignment fixture. A number of thermoplastic and thermocurable resists were molded in an isothermal process with total press occupancy of one cycle of less than 5 min. By further reducing overhead time for mounting and press closing, sub-minute imprint cycles seem possible.