Fan-Out Antenna-in-Package Integration Using Heatsink Antenna

Abstract

Antenna-in-package (AiP) has been widely applied for millimeter wave system integration. Fan-out interconnection provides low parasitic parameters and is the most suitable technology for monolithic microwave integrated circuit (MMIC) packaging. Thermal design should be considered due to high power consumption of mm-wave chips. For compact AiP system, arrangement of heat sink should not influence radiation performance. In this work, an AiP topology is proposed using 3-D fan-out integration, miniature horn antenna is adopted as heat sink with relative high gain and wide band. A small sized organic substrate board is embedded in molding compound for right-angle transition of millimeter wave signal. Choke structure is designed at the bottom surface of metal horn with improved transition performance. Two horn antennas are designed with measured gain 11.5 and 15.4 dB, respectively, bandwidth under return loss −10 dB is higher than 16.7% for 60 GHz wireless communication. The AiP system has been manufactured and measured on test board with well-functioned radiation performance. Thermal dissipation model is analyzed, measured results under 340 mW power consumption are consistent with simulation.