Abstract
In this paper, the combined test of temperature and vibration is conducted to statistically analyze the influence of temperature (25, 65, 105 °C) on lifetime and failure mode of SAC305 solder joint subjected to random vibration loading. Results indicate that vibration resistance of solder joint is greatly improved with temperature increase. Mean lifetime of solder joint at 65 and 105 °C is increased by 70 and 174 % respectively compared to that of solder joint at 25 °C. Failure modes are analyzed using scanning electron microscope. Different crack paths are observed at elevated test temperature. Results show that crack propagation path gradually changes from the interface of intermetallic compound (IMC)/Cu pad to bulk solder with temperature rise. Failure mechanism is remarkably transformed from brittle fracture to ductile fracture.
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