Abstract
The Thermally Stable Diamond Composite (TSDC) tipped pick has been developed to replace Tungsten Carbide (WC) tipped picks for hard rock cutting. Due to the material properties of TSDC, a major failure mode of TSDC tipped picks during rock cutting is random failures caused by excessive bending force acting on the cutting tips. A probabilistic approach has been proposed to estimate the failure probability of picks with this failure mode. However, there are two limitations in existing research: only one drum revolution is considered, and the variation of rock thickness is ignored. This study aims to extend the current approach via removing these limitations, based on the failure probability analysis of picks over a full cutting cycle in the underground coal mining roadway development process. The research results show that both drum advance direction and the variation of rock thickness have significant impacts on pick failure probability. The extended approach can be used to estimate pick failure probability for more realistic scenarios in real applications with improved accuracy. Although the study focused on TSDC tipped picks, the developed approach can also be applied to other types of picks.
Highlights
The Thermally Stable Diamond Composite (TSDC) material is made using ceramic-based silicon to bind synthetic diamond grains together [1,2]
Due to the use of silicon as the binder, the mechanical properties of TSDC remain stable at temperatures up to 1200 ◦ C [2]
Given that the influences of drum operating parameters, pick geometry, and the material properties of pick and rock have been analyzed in [11], and rock variations and drum advance directions are two new factors introduced in this extended approach, this study focused on the investigation of the influences of these two new factors on the pick failure probability
Summary
The Thermally Stable Diamond Composite (TSDC) material is made using ceramic-based silicon to bind synthetic diamond grains together [1,2]. As a type of diamond composite, the wear resistance of TSDC is several hundred times better than Tungsten Carbide (WC) [7,8]. Due to the use of silicon as the binder, the mechanical properties of TSDC remain stable at temperatures up to 1200 ◦ C [2]. The thermal stability of TSDC is much higher than that of ordinary polycrystalline diamond (PCD), which employs metallic cobalt as the binding material [2]. PCD is generally suitable for operational temperature below 750 ◦ C [9]
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