Abstract
Failure Modes and Effects Analysis (FMEA) is a systematic, learning retention vehicle originally developed by Ford Motor Company in the 1970s to aid the engineer in assessing potential failure modes and design in risk prevention measures for the automotive industry. This same approach can be applied, in much the same fashion, to the semiconductor manufacturing industry and result in retained learnings and a ranked priority of fab and die yield improvement activities. The FMEA system, as it is being applied to a National Semiconductor fab consists of a series of information templates that properly documents relevant information for each major processing step of each major process technology. This paper describes this FMEA system as it has been modified for use by National Semiconductor. The FMEA information template is detailed and the development and implementation approach on several of National Semiconductors major process technology flows is reviewed. The fit of the FMEA tool in the total process control scheme is discussed. In addition, specific examples of completed FMEAs for specific fabrication processing steps are presented along with actions taken to minimize calculated risk factors.
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