Failure Mode, Mechanism and Effect Analysis for Single Board Computers

Abstract

Failure Mode, Mechanism and Effect Analysis (FMMEA) is a reliability analysis method which is used to study possible failure modes, failure mechanisms of each component, and to identify the effects of various failure modes on the components and functions. This paper introduces how to implement FMMEA on the Single Board Computer in detail, including system definition, identification of potential failure modes, analysis of failure cause, failure mechanism, and failure effect analysis. Finite element analysis is carried out for the Single Board Computer, including thermal stress analysis and vibration stress analysis. Temperature distribution and vibration modes are obtained, which are the inputs of physics of failure models. Using a variety of Physics of Failure models, the quantitative calculation of single point failure for the Single Board Computer are carried out. Results showed that the time to failure (TTF) of random access memory chip which is SOP (small outline package) is the shortest and the failure is due to solder joint fatigue failure caused by the temperature cycle. It is the weak point of the entire circuit board. Thus solder joint thermal fatigue failure is the main failure mechanism of the Single Board Computer. In the implementation process of PHM for the Single Board Computer, the failure condition of this position should be monitored.