Failure Mechanism Studies and Elimination of Galvanic Corrosion (Al-Cu Cell) on Microchip Aluminum Bondpads in Copper Process

Abstract

Abstract In the authors' previous papers, the failure mechanism and elimination solutions of galvanic corrosion (Al-Cu cell) on microchip Al bondpads in the Al process (0.18un and above) have been studied [1-2]. In this paper, the authors will further study the failure mechanism and root cause of galvanic corrosion (Al-Cu cell) on microchip Al bondpads in the Cu process (0.13um and below) with Ta barrier metal. Based on our results, the root cause of galvanic corrosion (Al-Cu cell) in the Al process is only one way and Al-Cu cell is from Al alloy (Al + 0.5%Cu) on Al bondpads. However, in the Cu process it may be from two ways and Al-Cu cell can be from both Al alloy (Al + 0.5%Cu) on Al bondpads and the Cu metal layer below the barrier metal Ta when Ta has weak points or pinhole. As such, the pinhole defects on Al bondpad caused by galvanic corrosion (Al-Cu cell) in the Cu process might be more serious than that in the Al process. In this paper, TEM is used for root cause identification. Based on the TEM results, galvanic corrosion was due to the weak point/pinhole at the Ta barrier metal layer and Al-Cu diffusion.