Abstract
Reliability of joints in solar arrays significantly influences the service life of satellites. Interface between solar cell and interconnector experiences serious temperature cycling during space service which would further lead to failure. To further improve the interface joining thermal reliability, elucidation of the interface formation and corresponding microstructure evolution during thermal fatigue is necessary. In this study, parallel gap resistance welded (PGRW) multi-layered joint between GaAs solar cell and Ag foil are subjected to different temperature cycling tests (−160–120 °C, −165–160 °C) with various cycles. Obtained results confirm the joining mechanism of the joint as solid-solution interdiffusion between Ag foil and Au surface of solar cell electrode. Also, conducted temperature cycling essentially lead to thermal fatigue process at Ag/Au interface, therefore more serious interface strength degradation is generated by larger temperature cycling range. Joint failure is initiated by thermal fatigue induced dislocation and residual strain concentrations around dissimilar interface. And the large mismatch in coefficients of thermal expansion (CTE) of the multilayer structure amplifies the thermal fatigue effect.
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