Abstract
This tutorial illustrates design situations where creep and creep rupture of components can compromise system performance over time, thereby acting as a wearout failure mechanism. Polycrystalline materials, such as metals and ceramics, and polymers are treated. Analytic microstructural creep mechanisms leading to failure of these materials are presented. Continuum microscale models for predicting long-term creep are explained for practical design purposes. Two examples illustrate these models for mechanical engineering and electronic packaging situations. >
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