Abstract
This tutorial illustrates design and qualification situations where conductive filament formation, a failure mechanism that can occur in laminates, can affect product performance. Empirical models to design against this failure mechanism are presented in this paper. Examples illustrate the use of these models for design and qualification tests in electronic packaging.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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