Failure analysis on multilayer ceramic capacitor (MLCC) with leakage failure caused by silver (Ag) migration in molded plastic package

Abstract

Various analysis techniques inclusive cross section, parallel grinding, package decapsulation, SEM and EDX had been performed to determine the cause of high leakage on MLCC samples. At the end, analysis method combining the mechanical cracking and laser ablation was successfully pin point the failure was due to Ag migration at the external package of MLCC.