Abstract
Plastic encapsulated packages exhibit high leakage currents after a few hundred hours in the steam pressure pot test (SPP). The present study investigates two possible causes of leakage current. These are: (a) mold compound, (b) the polyimide tape used for co-planarity of lead frame fingers. The results of this study indicate that the leakage cur-rent is independent of the frame and is not caused by the mold compound. The data indicates that it is the ionic content and acrylic-based adhesive layer of the polyimide tape which cause the leakage current. To eliminate the leakage current, polyimide tape with low ionic content and non acrylic-based adhesive should be used.
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