Failure analysis of contact probe pins for SnPb and Sn applications

Abstract

A study has been conducted to investigate the failure mechanism of pogo pin-type probe contacts. Probe pins are used for electrical test of microelectronic components in manufacturing. A false rejection of parts due to high probe contact resistance results in a penalty in cost and yield. The probe pin contact bears distinctive characteristics of failure compared to the conventional contact systems such as mechanical switches and interconnects. Moreover, the transition to Pb-free component leads demands understanding of different probe failure mechanisms between a SnPb and Sn surface. The objective of this study is to understand this unique failure mechanism and the effect of lead coating metals on probe pin life. This has not been clearly elucidated to date in spite of its significant impact on yield and cost of electronic package manufacturing. A simulated probe tester with 3-axes actuation capability was devised to mimic the actual test process. The force required to penetrate the surface oxide layer and develop electrical contact was measured. Contact resistance history revealed that probe pins mating to Sn surfaces failed earlier than pins used on SnPb surfaces. Through periodic inspection of probe pins using microprobe/EDS as a function of probe actuations, the general root cause of probe pin failure was found to be probe pin tip wear out associated with the Sn oxide growth on its surface. The matte Sn surface wears the probe pin more than SnPb due to the rough and abrasive nature of the matte Sn surface.