Abstract
This paper presents failure analysis (FA) of the electrical interconnection of BGA packaging. The TDR (time domain reflectometry) measurement methodology is increasing in importance as a nondestructive method for fault location in BGA packages. Semiconductor manufacturers use TDR as a failure analysis tool because it can quickly perform nondestructive tests on packaged ICs. The measurement waveform of TDR makes it an easy and accuracy method that can assist with fault location in BGA packages. TDR can isolate open and short-circuit defects in the three main regions of an IC: open and short circuit in the copper tracks in the substrate, bond wire, and solder ball. We analyze in detail the TDR impedance as applicable to electronic BGA packaging fault location, focusing on the comparison of TDR measurement and X-ray modeling fault location.
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