Abstract
Finite element modeling is conducted to understand the factors that govern the performance of thermal interface pastes of controlled thickness between copper surfaces of controlled roughness. Carbon black paste is lower in thickness than metal particle paste, so it shows better performance. The performance of both pastes is more influenced by the paste-copper interfacial conductance than by the paste thermal conductivity. The effects of pressure, paste thickness, and copper surface roughness on performance are mainly due to the change in fractional filling of the valleys in the copper surface topography. Reasonable agreement is found between modeling and experimental results.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
