Abstract
In this study, we describe the fabrication of thermally conductive composites based on a polyphthalamide (PPA) matrix by the exfoliation of hexagonal BN nanosheets (BNNs) via the melt-mixing method. Boron nitride (BN) particles were hydroxyl groups surface-treated with sodium hydroxide (NaOH). Compared with existing BN peeling experiments, we successfully produced BNNs that are simpler, more economical, and have an excellent aspect ratio. For the same weight content of BN and BNNs, PPA/BN composites surface-treated with high aspect ratio BNNs have a high in-plane and through-plane thermal conductivity because of the intercalation of the hydroxyl group surface treatments between BN and PPA, which not only increases the wettability but also provides a good heat transfer path. Moreover, wide and thin BNNs are evenly dispersed inside the PPA/BN composite to provide excellent heat transfer paths in both in-plane and through-plane directions.
Highlights
One recent advancement indicating the tremendous progress in the field of electronics is the miniaturization of transistors, which allows for the integration of a greater number of transistors into a single device and improves device performance
boron nitride (BN) nanosheets (BNNs) fabricated with the BN foam and sonication, we observed the BN used by Fourier transform infrared spectroscopy (FT-IR)
BN is a two-dimensional material with a high thermal conductivity
Summary
One recent advancement indicating the tremendous progress in the field of electronics is the miniaturization of transistors, which allows for the integration of a greater number of transistors into a single device and improves device performance. The overheating of electronic devices can reduce the life of a device by more than half [1,2,3,4]. In order to ensure durability and stability, it is essential to heat dissipation that it be integrated for the operation of next-generation electronic devices. The reason why the heat conductivity between the heat sink and the electronic device is low, is due to the interfacial characteristics of these two surfaces (i.e., interstitial gaps). We show that by using a thermally conductive boundary material (TIM) to adhere to the rough interface structure, we can eliminate this crevice gap at the interface. TIM is used to induce excellent heat transfer by minimizing the pores between the two interfaces [5,6,7]
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