Abstract
Porous copper (Cu) films were facilely and greenly fabricated by low-current electrical field-induced assembly of ~ 3 nm Cu nanoparticles (NPs) in several minutes using generated hydrogen bubbles as dynamic negative templates. The porous films had open three-dimensionally (3D) interconnected nanopores and uniform pore size distribution and exhibited a hierarchical structure composed of supraparticles that were further composed of the Cu NPs. Lattice-to-lattice connectivity in the self-assembly of the NPs in the 3D structures enables fast charge transport. The structure/morphology of the porous Cu materials can be tuned by adjusting the concentration of the additives, applied potential/current densities and assembly time. A growth mechanism of the porous films was reasonably proposed for the field-induced assembly of the Cu NPs. The porous Cu film-supported Si electrode showed high capacity of 1173 mAh g−1 and retention rate of 87% after 10 cycles at 1 C. Our research sheds a light on preparing 3D nanoporous structures especially for suitable electrodes in electrochemical energy storage devices.
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