Fabrication of three-dimensional Cu/Ni multilayered microstructure by wet process

Abstract

Three-dimensional (3D) microstructures were formed using a wet process consisting of the formation of a multilayered microstructure and selective etching of the other layers of the structure. Cylindric Cu/Ni multilayered microstructures of 50 μm in diameter and 30 μm in height were formed by electroplating and photolithography. Cu layers were then etched selectively in acidic thiourea solution. The redox reaction of the multilayered microstructure in the solution was investigated electrochemically. The shapes of three-dimensional microstructures were affected by the surface morphology of the deposited films. Various three-dimensional microstructures having controlled geometric unevenness were obtained using films having smooth surface morphology.