Fabrication of Submicron Pattern with an EB Lithographic System Using a Field Emission (FE) Electron Gun

Abstract

This paper describes the advantages of an EB Lithographic system using an FE electron gun and steered-beam vector scan to fabricate submicron patterns. Application of this system to submicron pattern writing is studied through exposure intensity distribution (EID) and exposure dosage for submicron patterns. The system can carry out submicron pattern writing with high resolution and small proximity effect. For example, the system provides submicron resist patters with line width larger than 0.5 µm and gap spacing 1.0 µm without proximity effect correction. The application of this system to VLSI submicron pattern writing is also demonstrated.