Fabrication of sub-micrometer 3D structures for terahertz oscillators by electron beam gray-tone lithography

Abstract

More and more novel applications are appearing in the almost-unexplored-up-to-recent-times frequency range of around 0.3–3 terahertz (THz), where sub-millimeter radio waves meet far-infrared optical waves. Resonant tunneling diodes (RTDs) are considered one of the promising compact and coherent room temperature signal sources for terahertz applications. In this work, the fabrication process and fabrication challenges for an RTD THz oscillator with a cylindrical resonant cavity are discussed. Successful fabrication of 3D metallic structures with a height of 2–5 μm and a feature size down to 0.5 μm was achieved by combining the traditional trilayer resist process with the dose-modulated (gray-tone) electron-beam (EB) lithography process. It was shown that two-step EB exposure could be used in thick (>2.4 μm) PMMA resist to achieve predictable and controllable fabrication of V-shaped metallic structures with lateral sizes down to 0.5 μm. Applicability of the described fabrication approach was proven by the measurement of oscillation characteristics for the fabricated RTD THz oscillators. Successful operation of the RTD oscillator devices confirms good electrical contact between the top contact of the RTD mesa structure and the RTD pillar structure as well as between the resonant cavity and antenna parts. The fabrication approach described in this work allowed us to eliminate parasitic capacitance formed around RTD mesa in the first fabrication trial and achieve a frequency increase of up to 200 GHz for RTD THz oscillators operating at frequencies 1.5–1.7 THz. The described fabrication approach may also be applicable for the fabrication of 3D metallic structures with a feature size less than 0.5 μm and a height more than 2 μm with EB energies above 50 keV.