Abstract
Spindt-type field emitter arrays of tungsten microtips have been fabricated by optimizing aluminum parting layers. The aluminum parting layers, which play a crucial role in the subsequent deposition of peeling-free tungsten films, are characterized by varying the deposition conditions. The aluminum parting layer deposited at a high vacuum level has a good stress relaxation effect, and tungsten microtip field emitter arrays, free of peeling, are successfully fabricated and show good electrical characteristics.
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Schedule a callMore From: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
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