Fabrication of silver stabilization layer of coated conductor using organic silver complexes

Abstract

Silver stabilizing layer of coated conductor has been prepared by dip coating method using organic silver complexes containing 10wt.% silver as a starting material. Coated silver complex layer was dried in situ with hot air and converted to crystalline silver by post heat treatment in flowing oxygen atmosphere. A dense continuous silver layer with good surface coverage and proper thickness of 230nm is obtained by multiple dip coatings and heat treatments. The film heat treated at 500°C showed good mechanical adhesion and crystallographic property. The interface resistivity between superconducting YBCO layer and silver layer prepared by dip coating was measured as 0.67×10−13Ωm2.Additional protecting copper layer with the thickness of 20μm was successfully deposited by electroplating. The critical current measured with the specimen prepared by dip coating and sputtering on same quality YBCO layer showed similar value of ∼140A and proved its ability to replace sputtering method for industrial production of coated conductor.