Abstract

Zinc oxide (ZnO)-based semiconductor is a promising application for ultraviolet photodetectors (UV PDs). The performance of ZnO UV PDs can be improved in two orientations: by reduction of the dark current and by increasing the photocurrent. In the study, we used two processes to prepare ZnO UV PDs: photochemical vapor deposition to fabricate silicon dioxide as an insulator layer and a radio frequency sputter system to prepare the ZnO film as an active layer. The results show that the silicon dioxide layer can reduce the dark current. Moreover, a large photo–dark current ratio of the metal–insulator–semiconductor (MIS) structured PD is 200 times than the metal–semiconductor–metal (MSM) structured PD. When the silicon dioxide thickness is 98 nm, we can significantly enhance the rejection ratio. The silicon dioxide layer can reduce the noise effect and enhance the device detectivity. These results indicate that the insertion of a silicon dioxide layer into ZnO PDs is potentially useful for practical applications.

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