Abstract
In this paper, we describe a procedure for the processing of SiC‐whisker‐reinforced MoSi2 composites via tape casting. Based on the characteristics of SiC whiskers and MoSi2 powder in aqueous and nonaqueous solvents, a slip formulation (solvent, dispersant, binder, etc.) has been developed. The formulation developed allows for a uniform distribution of SiC whiskers in the matrix, easy separation of the tapes from the polymeric carrier, convenient control of both tape thickness and orientation of SiC whiskers, and a low binder burnout temperature. The latter is important for the prevention of the oxidation of MoSi2 powder during the binder burnout in an oxidizing atmosphere.
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