Fabrication of Robust Nano-Signatures for Identification of Authentic Electronic Components and Counterfeit Avoidance

Abstract

In this paper, a novel approach for marking integrated circuit packages with authentication nanosignatures is introduced. In this work, the signatures patterns are fabricated using electron beam lithography. Moreover, the robustness of these signatures against aging and humidity is investigated. A recipe comprising image processing techniques and measurement of similarity indices has been developed. These signatures are proposed to be fabricated at the manufacturer side of the supply chain. Then, they are decoded at the consumer end. Thus, robustness against ambient environment and aging is a requirement for these signatures to survive in the global supply chain. Calculated Mean Square Error and Structural SIMilarity Index confirmed that the reflected patterns of the signatures remain unchanged against aging and humidity.