Abstract
To develop a high-quality Weyl magnet ${\mathrm{Mn}}_{3}\mathrm{Sn}$ thin film, polycrystalline Mn-Sn was sputter deposited onto an fcc or hexagonal close-packed metallic seed layer of Pt, Cu, Ir, Ru, Cr, or Al. Among the tested seed materials, Pt and Cu enabled fabrication of highly $c$-plane oriented textured $D{0}_{19}$-type ${\mathrm{Mn}}_{3}\mathrm{Sn}$ films with a smooth surface (mean roughness below 0.3 nm) after postannealing at $350{\phantom{\rule{0.16em}{0ex}}}^{\ensuremath{\circ}}\mathrm{C}$ or below. The ${\mathrm{Mn}}_{3}\mathrm{Sn}$ films exhibited substantial signals of the anomalous Nernst effect (ANE), which is one characteristic of a Weyl magnet. Microstructural analysis revealed that the Cu seed layer significantly diffused into the ${\mathrm{Mn}}_{3}\mathrm{Sn}$ layer during postannealing, while the Pt seed layer changed little. The results suggested that a small amount of Cu mixture (up to 2.5 at. %) did not degrade the ANE signal but effectively lowered the postannealing temperature to form the $D{0}_{19}$ structure. The developed films and techniques are beneficial for antiferromagnetic spintronics in terms of the smoothness and process consistency in a standard process for magnetic random-access memory.
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