Abstract

The fabrication of piezoelectric supports for straining thin film electrodes using standard photolithography, sputter coating, and atomic layer deposition is detailed. An interdigitated array on the back of single crystal lithium niobate piezoelectric substrates allows large electric fields to be applied to strain thin films on the front of the device. A thin metal oxide insulating layer prevents electronic communication between the electrode of interest and the underlying piezoelectric. Platinum thin films (<10 nm) can be sputtered and annealed to produce quality electrodes. Microelectrode arrays can be patterned on the electrode via another oxide layer or insulating resist. The various challenges of fabricating and testing these devices as well as future prospects are discussed.

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