Abstract

In this work, we demonstrate the feasibility and performance of photon sieve diffractive optical elements fabricated via a direct laser ablation process. Pulses of 50 ns width and wavelength 1064 nm from an ytterbium fiber laser were focused to a spot diameter of approximately 35 µm. Using a galvanometric scan head writing at 100 mm/s, a 30.22 mm2 photon sieve operating at 633 nm wavelength with a focal length of 400 mm was fabricated. The optical performance of the sieve was characterized and is in strong agreement with numerical simulations, producing a focal spot size full-width at half-maximum (FWHM) of 45.12 ± 0.74 µm with a photon sieve minimum pinhole diameter of 62.2 µm. The total time to write the photon sieve pattern was 28 seconds as compared to many hours using photolithography methods. We also present, for the first time to our knowledge in the literature, thorough characterization of the influence of angle of incidence, temperature, and illumination wavelength on photon sieve performance. Thus, this work demonstrates the potential for a high speed, low cost fabrication method of photon sieves that is highly customizable and capable of producing sieves with low or high numerical apertures.

Highlights

  • Diffractive optical elements (DOEs) offer a lightweight, planar alternative to traditional refractive lenses [1] due to their operating on the principles of optical diffraction and interference, unlike standard refractory optics

  • We have successfully demonstrated the fabrication of photon sieve lenses via laser ablation process

  • A photon sieve of 400 mm focal length and area of 30.22 mm2 was fabricated by means of a nanosecond-pulsed ytterbium fiber laser

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Summary

Introduction

Diffractive optical elements (DOEs) offer a lightweight, planar alternative to traditional refractive lenses [1] due to their operating on the principles of optical diffraction and interference, unlike standard refractory optics. It was shown that these photon sieves were capable of producing focus spots smaller than their minimum pinhole diameter due to the suppression of higher order diffraction maxima and larger numerical apertures. This property has made photon sieves attractive for applications such as space telescopes to study heliophysics and other astronomical phenomenon [3], improved signal-to-noise ratios in LIDAR systems [4], focusing elements in maskless. Mask-based lithography is very fast, but requires a new mask to be fabricated each time even a small change is made to the photon sieve design, and is not ideal for applications with changing design parameters. The operation tolerances for photon sieves have not been thoroughly examined previous to this work, leaving a gap in understanding for actual integration of photon sieve devices into their applications

Simulation of Photon Sieve Focal Point FWHM and Diffraction
Photon Sieve Fabrication via Laser Ablation
Photon Sieve Pinhole Morphology
Characterization of Photon Sieve Focal Spot Size and Efficiency
Conclusion
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